Applications

- Film deposition

- Plasma etching

- Surface cleaning

- Quality control

- Closed-loop control

- plasma chamber health control

- Protection coating

- Pulsed magnetron sputtering: crystalline aluminum coatings

- monitoring the endpoint when blanket polysilicon (100% Si loading) is being plagiarized

- monitoring the recess depth while plugs are being recessed (<10% Si loading)

- Precise endpoint control

- Control of abnormal process phenomena, (pollution, discharge)

- easy but complete optimization of new processes

- Use to capacity of chamber and decrease number of monitor samples (wafers) by optimization of Cleaning Cycles